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DBT1000

DBT-1200

Speci? cations:

Die size: from 300x300μm Thickness: from 3 mil and up

2 basic con? gurations:

? Modul I : XYZ and Theta for Chip handling

? Modul II : XYZ,， hi resolution， for multi chuck Shuttle and pin Test centering Z motion with adjustable angle

Pickup Tool offset to Crosshair: programmable

Test　Pin　to crosshair: programmable

Joystick: proportionnal speed

Chip hold on chuck by vacuum

Two LCD display,， used for wafer handling and for Test Monitoring.

Video Target generator for alignment.

Lights: Direct and pen LED lights.

Speci?cations:

Die size: from 250x250μm (10mil) Thickness: from 75μm,， (3 mil) and up

2 basic con? gurations:

? Modul I : XYZ and Theta for Chip handling， ? Modul II : XYZ,， hi resolution， for multi chuck Shuttle and pin Test centering Z motion with adjustable angle

Pickup Tool offset to Crosshair: programmable

Test Pin to crosshair: programmable

Joystick: proportionnal speed

Chip hold on chuck by vacuum

Two LCD display,， used for wafer handling and for Test Monitoring.

Video Target generator for alignment.

Lights: Direct and pen LED lights.

Facilities:

Power: 100-240vac