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真空回流焊:
Process environment | nitrogen,, inert gas,, formic acid, forming gas |
Maximum temperature | 450°C |
Heating area | 420 x 420 mm |
Heating plate | removable: graphite, aluminum,, etc. |
Clearance above heating plate | 60 mm |
Heat up / cool down ramp | 250°C/min |
Control deviation | +/- 0.5°C |
Heating elements | 16x infrared heating lamps in two crossed rows |
Heating control | individual/adjustable on every heating lamp |
Cooling of heating plate | nitrogen flow |
Temperature measurement | up to 4x thermocouples K-Type freely positional |
Pressure measurement | full range over two gauges |
Maximum vacuum | 1x10-2 mbar (5x10-6 mbar with turbo pump) |
Formic acid bubbler | 40 ml container in front panel with auto refill |
Cooling of chamber body | water/ethylene glycol mixture |
Lid viewing port | 80 mm with shutter |
Display | 7" LCD with touch screen |
PC Software | process logging,, recipe transfer, etc. |
User interface | remote control over relay I/Os |
Dimensions | see layout |
Weight | 280 kg |
Power supply | 3 phase,, country specific |
**客戶(hù):
應(yīng)用:
在真空和惰性氣體中加熱,、散熱器上的功率半導(dǎo)體、倒裝芯片回流焊,、凸點(diǎn)熔化,、高強(qiáng)度LED連接、密封封裝密封,、光伏電池組件,、模具連接、印刷銅膜燒結(jié),、混合電路組件,、扁平封裝封裝、微機(jī)電系統(tǒng)和光電器件封裝,,汽車(chē)傳感器,、高能電池等。
暫無(wú)數(shù)據(jù),!